The DragonFly™ 2020 Pro 3D Printer produces professional multilayer printed circuit boards (PCBs) and 3D circuitry. It is the ultimate rapid prototyping tool for electronics professionals.
3D printing (also known as additive manufacturing) has earned its position as one of the most exciting technologies to come to market in the last decade. It has transformed the world of product design and is now making significant inroads into manufacturing.
The DragonFly 2020 Pro system brings together an extremely precise inkjet deposition printer, high performance silver nano-particle conductive and dielectric inks as well as dedicated software, in order to bring the benefits of 3D printing to electronics professionals. This advanced printing platform is dedicated to the production of professional multilayer PCB prototypes and other circuitry inhouse, within hours.
The innovative hardware, dedicated nano-inks and novel software offers virtually limitless design flexibility to a wide range of research and development, prototyping and custom manufacturing projects.
The rapid prototyping capabilities of the DragonFly 2020 Pro 3D Printer for professional 3D printed electronics completely transforms the ways product development teams work. No more waiting days or weeks for a custom PCB prototype that has to be fabricated offsite. The DragonFly 2020 Pro 3D Printer offers the flexibility to print an entire board or just part of a circuit. You can develop the RF and digital sections of the board in parallel, test and iterate on the fly. The DragonFly 2020 Pro 3D Printer empowers progress and encourages innovation, lessening development risks and enabling faster times-to-market - and ultimately, better products.
The DragonFly™ 2020 Pro 3D Printer deposits two materials, one conductive and one dielectric, in order to build a complete multilayer PCB from the bottom up. Each pass of the printhead deposits dielectric and conductive material at the exact location specified by the design file. Starting from the underside conductive traces, the materials are built up to finish with the topside conductors. This process means that vias are built up, drop by drop, either as blind, open or complete vias. Plated and non-plated through-holes are created by repeatedly leaving a space at a particular XY coordinate, thereby building surrounding materials up around a void. The dielectric ends up as a solid piece within which the conductive traces are positioned at the precise XYZ coordinates specified.